BILLERICA, Mass.– Bruker Corporation (Nasdaq: BRKR) announced it has shipped and installed its 15th InSight WLI 3D optical metrology system to a leading semiconductor manufacturer, marking a significant milestone in a larger order of 27 systems scheduled for delivery in 2025. The surge in demand is tied to the growing global need for high-performance chips used in artificial intelligence (AI) applications, which increasingly rely on advanced packaging techniques.
As AI becomes more embedded in both consumer electronics and industrial technologies, chipmakers are pushing for higher speed, efficiency, and power density. To achieve this, manufacturers are adopting advanced packaging architectures that integrate multiple chips—such as processors, memory units, and accelerators—into a single compact package. This multi-die stacking and heterogeneous integration approach supports AI’s requirements for high bandwidth, low latency, and improved power efficiency, but it also raises new engineering challenges.
Bruker’s InSight WLI system addresses these challenges by providing non-contact, high-resolution 3D optical metrology. The system measures critical aspects of chip packaging such as layer-to-layer alignment, surface topography, and coplanarity, all of which are vital for maintaining yield and ensuring performance in AI-grade semiconductors.
“Bruker has long worked alongside semiconductor manufacturers to develop precision metrology that keeps pace with rapid technology shifts,” said David V. Rossi, President of Bruker’s Nano Surfaces and Metrology Division. “This multi-system order highlights our role in supporting the industry’s transition to advanced packaging, which is key to powering the next generation of AI chips.”
The latest order underscores Bruker’s position as a trusted supplier of high-precision metrology systems for semiconductor fabrication. As chipmakers ramp up production and open new fabrication facilities, Bruker expects continued demand for its solutions across global markets.
With the industry’s increasing reliance on advanced packaging to meet the performance demands of AI, Bruker’s metrology systems are playing an essential role in enabling the production of reliable, high-throughput, and energy-efficient chips.
